Invention Grant
- Patent Title: Multilayer wiring board and method for manufacturing the same
- Patent Title (中): 多层布线板及其制造方法
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Application No.: US12543644Application Date: 2009-08-19
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Publication No.: US08525041B2Publication Date: 2013-09-03
- Inventor: Keisuke Shimizu , Yoichiro Kawamura
- Applicant: Keisuke Shimizu , Yoichiro Kawamura
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A wiring board has a substrate, a conductive pattern formed over the substrate, and an electronic component mounted to the substrate and having an electrode. The electrode of the electronic component is connected to the conductive pattern through a via hole. The thickness of the electrode of the electronic component is made less than the thickness of the conductive pattern.
Public/Granted literature
- US20100214752A1 MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-08-26
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