Invention Grant
- Patent Title: Modular lead interconnector
- Patent Title (中): 模块化引线互连器
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Application No.: US12937644Application Date: 2009-01-23
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Publication No.: US08525027B2Publication Date: 2013-09-03
- Inventor: Gerald G. Lindner , Paulette C. Olson , Darren A. Janzig , Chris J. Paidosh
- Applicant: Gerald G. Lindner , Paulette C. Olson , Darren A. Janzig , Chris J. Paidosh
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- International Application: PCT/US2009/031785 WO 20090123
- International Announcement: WO2009/131725 WO 20091029
- Main IPC: H01B17/08
- IPC: H01B17/08

Abstract:
An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.
Public/Granted literature
- US20110165785A1 MODULAR LEAD INTERCONNECTOR Public/Granted day:2011-07-07
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