Invention Grant
US08524542B2 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
有权
空白包括具有半导体芯片和塑料封装模塑复合体的复合面板及其制造方法和模具
- Patent Title: Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
- Patent Title (中): 空白包括具有半导体芯片和塑料封装模塑复合体的复合面板及其制造方法和模具
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Application No.: US13556837Application Date: 2012-07-24
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Publication No.: US08524542B2Publication Date: 2013-09-03
- Inventor: Markus Brunnbauer , Edward Fuergut
- Applicant: Markus Brunnbauer , Edward Fuergut
- Applicant Address: DE Neubiberg
- Assignee: Intel Mobile Communications GmbH
- Current Assignee: Intel Mobile Communications GmbH
- Current Assignee Address: DE Neubiberg
- Priority: DE102006012738 20060317
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A blank and a semiconductor device include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.
Public/Granted literature
Information query
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