Invention Grant
- Patent Title: Brace for wire bond
- Patent Title (中): 电线接头支架
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Application No.: US13170208Application Date: 2011-06-28
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Publication No.: US08524529B2Publication Date: 2013-09-03
- Inventor: Meiquan Huang , Hejin Liu , Hanmin Zhang
- Applicant: Meiquan Huang , Hejin Liu , Hanmin Zhang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201010292924 20100925
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.
Public/Granted literature
- US20120077316A1 BRACE FOR WIRE BOND Public/Granted day:2012-03-29
Information query
IPC分类: