Invention Grant
- Patent Title: Dry adhesives and methods for making dry adhesives
- Patent Title (中): 干粘合剂和干粘合剂的制造方法
-
Application No.: US12448243Application Date: 2007-12-14
-
Publication No.: US08524092B2Publication Date: 2013-09-03
- Inventor: Metin Sitti , Seok Kim
- Applicant: Metin Sitti , Seok Kim
- Applicant Address: US PA Pittsburgh
- Assignee: Carnegie Mellon University
- Current Assignee: Carnegie Mellon University
- Current Assignee Address: US PA Pittsburgh
- Agent David G. Oberdick; Peter J. Borghetti
- International Application: PCT/US2007/025684 WO 20071214
- International Announcement: WO2008/076391 WO 20080626
- Main IPC: C25F3/00
- IPC: C25F3/00
Abstract:
A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.
Public/Granted literature
- US20100136281A1 DRY ADHESIVES AND METHODS FOR MAKING DRY ADHESIVES Public/Granted day:2010-06-03
Information query
