Invention Grant
US08523636B2 Working object grinding method 有权
工作对象研磨方法

  • Patent Title: Working object grinding method
  • Patent Title (中): 工作对象研磨方法
  • Application No.: US12744714
    Application Date: 2008-11-18
  • Publication No.: US08523636B2
    Publication Date: 2013-09-03
  • Inventor: Naoki Uchiyama
  • Applicant: Naoki Uchiyama
  • Applicant Address: JP Hamamatsu-shi, Shizuoka
  • Assignee: Hamamatsu Photonics K.K.
  • Current Assignee: Hamamatsu Photonics K.K.
  • Current Assignee Address: JP Hamamatsu-shi, Shizuoka
  • Agency: Drinker Biddle & Reath LLP
  • Priority: JP2007-311643 20071130
  • International Application: PCT/JP2008/070947 WO 20081118
  • International Announcement: WO2009/069509 WO 20090604
  • Main IPC: B24B1/00
  • IPC: B24B1/00
Working object grinding method
Abstract:
A working object grinding method capable of grinding a working object reliably is provided. A working object 1 is irradiated with a laser beam while locating a converging point therewithin, so as to form a reformed region 7 in the working object 1 along a reformed-region forming line set at a predetermined distance inside from an outer edge of the working object 1 along the outer edge, and a rear face 21 of the working object 1 is ground. As a result, the reformed region 7 or fissures C1 extending therefrom can inhibit fissures generated in an outer edge portion 25 upon grinding the working object 1 from advancing to the inside, whereby the working object 1 can be prevented from fracturing.
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