Invention Grant
- Patent Title: Working object grinding method
- Patent Title (中): 工作对象研磨方法
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Application No.: US12744714Application Date: 2008-11-18
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Publication No.: US08523636B2Publication Date: 2013-09-03
- Inventor: Naoki Uchiyama
- Applicant: Naoki Uchiyama
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2007-311643 20071130
- International Application: PCT/JP2008/070947 WO 20081118
- International Announcement: WO2009/069509 WO 20090604
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
A working object grinding method capable of grinding a working object reliably is provided. A working object 1 is irradiated with a laser beam while locating a converging point therewithin, so as to form a reformed region 7 in the working object 1 along a reformed-region forming line set at a predetermined distance inside from an outer edge of the working object 1 along the outer edge, and a rear face 21 of the working object 1 is ground. As a result, the reformed region 7 or fissures C1 extending therefrom can inhibit fissures generated in an outer edge portion 25 upon grinding the working object 1 from advancing to the inside, whereby the working object 1 can be prevented from fracturing.
Public/Granted literature
- US20100311313A1 WORKING OBJECT GRINDING METHOD Public/Granted day:2010-12-09
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