Invention Grant
- Patent Title: High frequency adapter
- Patent Title (中): 高频适配器
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Application No.: US13371776Application Date: 2012-02-13
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Publication No.: US08523618B2Publication Date: 2013-09-03
- Inventor: Ted Ju , Tien Chih Yu
- Applicant: Ted Ju , Tien Chih Yu
- Applicant Address: TW Keelung
- Assignee: Lotes Co., Ltd.
- Current Assignee: Lotes Co., Ltd.
- Current Assignee Address: TW Keelung
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN201120459105 20111118
- Main IPC: H01R11/22
- IPC: H01R11/22

Abstract:
A high frequency adapter electrically connecting a docking device to a circuit board. The high frequency adapter includes an insulating body, a high frequency signal terminal conductively connected to the circuit board, and two grounding terminals located at two sides of the high frequency signal terminal and conductively connected to the circuit board. Lateral projections of the high frequency signal terminal and the two grounding terminals are approximately the same and overlapping. Both the high frequency signal terminal and the two grounding terminals are pressed by the docking device.
Public/Granted literature
- US20130130558A1 HIGH FREQUENCY ADAPTER Public/Granted day:2013-05-23
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