Invention Grant
- Patent Title: Card socket
- Patent Title (中): 卡插座
-
Application No.: US12995342Application Date: 2009-03-27
-
Publication No.: US08523614B2Publication Date: 2013-09-03
- Inventor: Akihiro Matsunaga
- Applicant: Akihiro Matsunaga
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2008-143614 20080530
- International Application: PCT/JP2009/001404 WO 20090327
- International Announcement: WO2009/144865 WO 20091203
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
[Object] To provide a card socket having a structure that achieves a low profile.[Solving Means] The base portion of a card frame is basically constituted by a base frame (100) made of metal. Resin is used only for parts where absolutely necessary, such as a housing (200) for retaining contacts (300) and a switch piece holding housing (700) that retains a second switch piece (620). Thus, the resin thickness can be reduced while maintaining the strength of the card socket, so that the structure of the card socket is simplified and a low profile can be achieved.
Public/Granted literature
- US20110104920A1 CARD SOCKET Public/Granted day:2011-05-05
Information query