Invention Grant
- Patent Title: Method and apparatus for mounting a fluid ejection module
- Patent Title (中): 用于安装流体喷射模块的方法和装置
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Application No.: US12991758Application Date: 2009-05-06
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Publication No.: US08523323B2Publication Date: 2013-09-03
- Inventor: Kevin Von Essen , Stephen R. Deming , John A. Higginson , Nobuo Matsumoto , Andreas Bibl
- Applicant: Kevin Von Essen , Stephen R. Deming , John A. Higginson , Nobuo Matsumoto , Andreas Bibl
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fish & Richardson P.C.
- International Application: PCT/US2009/042994 WO 20090506
- International Announcement: WO2009/142910 WO 20091126
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.
Public/Granted literature
- US20110128324A1 METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE Public/Granted day:2011-06-02
Information query
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