Invention Grant
- Patent Title: Electronic assemblies and methods of forming electronic assemblies
- Patent Title (中): 电子组件和形成电子组件的方法
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Application No.: US13082367Application Date: 2011-04-07
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Publication No.: US08523071B2Publication Date: 2013-09-03
- Inventor: Andrew DePaula , Larry Aamodt , Ronald Vyhmeister
- Applicant: Andrew DePaula , Larry Aamodt , Ronald Vyhmeister
- Applicant Address: US WA Spokane
- Assignee: Intellipaper, LLC
- Current Assignee: Intellipaper, LLC
- Current Assignee Address: US WA Spokane
- Agency: Wells St. John P.S.
- Main IPC: G06K7/00
- IPC: G06K7/00
Abstract:
An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
Public/Granted literature
- US20120081868A1 Electronic Assemblies and Methods of Forming Electronic Assemblies Public/Granted day:2012-04-05
Information query
