Invention Grant
- Patent Title: Forming an array of metal balls or shapes on a substrate
- Patent Title (中): 在基材上形成金属球或形状的阵列
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Application No.: US13655426Application Date: 2012-10-18
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Publication No.: US08523046B1Publication Date: 2013-09-03
- Inventor: Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis J. Percello; Robert M. Trepp
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask.
Information query
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