Invention Grant
- Patent Title: Microphere-containing insulation
- Patent Title (中): 微量保温
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Application No.: US12516410Application Date: 2007-11-27
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Publication No.: US08522829B2Publication Date: 2013-09-03
- Inventor: Andrew S. D'Souza , Robert W. Hunter , Maria B. Urquiola
- Applicant: Andrew S. D'Souza , Robert W. Hunter , Maria B. Urquiola
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- International Application: PCT/US2007/085558 WO 20071127
- International Announcement: WO2008/067267 WO 20080605
- Main IPC: F16L9/14
- IPC: F16L9/14

Abstract:
An insulated article having a first insulation region comprising a first polymeric material and first hollow ceramic microspheres and a second insulation region comprising a second polymeric material and second hollow ceramic microspheres. The first insulation region has a thermal conductivity that is no greater than the thermal conductivity of the first polymeric material and a volumetric heat capacity in a range of 60% to 90% of the volumetric heat capacity of the first polymeric material. The second insulation region has a thermal conductivity that is no greater than 90% of the thermal conductivity of the second polymeric material and a volumetric heat capacity that is less than 60% of the volumetric heat capacity of the second polymeric material. A method for making a composition for insulating an article is also described.
Public/Granted literature
- US20100126618A1 MICROPHERE-CONTAINING INSULATION Public/Granted day:2010-05-27
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