Invention Grant
US08522570B2 Integrated circuit chip cooling using magnetohydrodynamics and recycled power
有权
使用磁流体动力学和回收功率的集成电路芯片冷却
- Patent Title: Integrated circuit chip cooling using magnetohydrodynamics and recycled power
- Patent Title (中): 使用磁流体动力学和回收功率的集成电路芯片冷却
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Application No.: US12138853Application Date: 2008-06-13
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Publication No.: US08522570B2Publication Date: 2013-09-03
- Inventor: Chien Ouyang , Kenny C. Gross , Ali Heydari
- Applicant: Chien Ouyang , Kenny C. Gross , Ali Heydari
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood Shores
- Agency: Park, Vaughan, Fleming & Dowler, LLP
- Agent Chia-Hsin Suen
- Main IPC: F25D23/12
- IPC: F25D23/12
Abstract:
Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.
Public/Granted literature
- US20090308081A1 INTEGRATED CIRCUIT CHIP COOLING USING MAGNETOHYDRODYNAMICS AND RECYCLED POWER Public/Granted day:2009-12-17
Information query
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