Invention Grant
- Patent Title: Method for producing a sensor board
- Patent Title (中): 传感器板的制造方法
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Application No.: US12461492Application Date: 2009-08-13
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Publication No.: US08522428B2Publication Date: 2013-09-03
- Inventor: Hiroyuki Hanazono , Hiroshi Yamazaki
- Applicant: Hiroyuki Hanazono , Hiroshi Yamazaki
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-241425 20080919
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10
Abstract:
A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
Public/Granted literature
- US20100073886A1 Sensor board and producing method thereof Public/Granted day:2010-03-25
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