Invention Grant
- Patent Title: Wiring connection apparatus
- Patent Title (中): 接线装置
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Application No.: US12003937Application Date: 2008-01-03
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Publication No.: US08522424B2Publication Date: 2013-09-03
- Inventor: Yoshinori Hoshino , Naoya Yamazaki , Hiroshi Katagiri , Hideaki Matsumoto
- Applicant: Yoshinori Hoshino , Naoya Yamazaki , Hiroshi Katagiri , Hideaki Matsumoto
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2007-001019 20070109
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01R43/00

Abstract:
According to an aspect of an embodiment, a wiring connection apparatus comprises a tray including a plurality of wiring connection members for connecting a plurality of wiring and a tray holder body, which holds the tray, wherein the tray is rotatably provided in the tray holder body, and a wiring introduction opening for introducing the plurality of wiring into the tray is formed in proximity to an axis of rotation of the tray.
Public/Granted literature
- US20080163482A1 Wiring connection apparatus Public/Granted day:2008-07-10
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