Invention Grant
- Patent Title: Method for non-shrinkable IP integration
- Patent Title (中): 不收缩IP集成方法
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Application No.: US12895264Application Date: 2010-09-30
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Publication No.: US08504965B2Publication Date: 2013-08-06
- Inventor: Hung-Yi Liu , Chung-Hsing Wang , Yung-Chin Hou , Lie-Szu Juang
- Applicant: Hung-Yi Liu , Chung-Hsing Wang , Yung-Chin Hou , Lie-Szu Juang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of designing integrated circuits includes providing a design of an integrated circuit at a first scale, wherein the integrated circuit includes a shrinkable circuit including a first intellectual property (IP); and a non-shrinkable circuit including a second IP having a hierarchical structure. A marker layer is formed to cover the non-shrinkable circuit, wherein the shrinkable circuit is not covered by the marker layer. The electrical performance of the non-shrinkable circuit is simulated using a simulation tool, wherein the simulated non-shrinkable circuit is at a second scale smaller than the first scale.
Public/Granted literature
- US20120084745A1 Design Method for Non-Shrinkable IP Integration Public/Granted day:2012-04-05
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