Invention Grant
- Patent Title: Mountable electronic circuit module
- Patent Title (中): 可安装电子电路模块
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Application No.: US13094925Application Date: 2011-04-27
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Publication No.: US08503188B2Publication Date: 2013-08-06
- Inventor: Katsumi Taniguchi
- Applicant: Katsumi Taniguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-283377 20081104
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A mountable electronic circuit module which produces appropriate characteristics without a complicated structure can be a DC-DC converter including a baseboard made of a magnetic material. A helical electrode is provided in the baseboard so as to function as a smoothing inductor device. Capacitor devices in addition to a DC-DC converter IC are mounted on a main surface of the baseboard. A circuit electrode arranged to connect the circuit devices is provided to enable the circuit devices to function as the DC-DC converter. The DC-DC converter is mounted on a motherboard through external connection electrodes of the capacitor devices.
Public/Granted literature
- US20110199745A1 MOUNTABLE ELECTRONIC CIRCUIT MODULE Public/Granted day:2011-08-18
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