Invention Grant
- Patent Title: Supplementary cooling system
- Patent Title (中): 补充冷却系统
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Application No.: US12768931Application Date: 2010-04-28
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Publication No.: US08503172B2Publication Date: 2013-08-06
- Inventor: Fusanobu Nakamura , Hiroaki Agata
- Applicant: Fusanobu Nakamura , Hiroaki Agata
- Applicant Address: SG New Tech Park
- Assignee: Lenovo Pte. Ltd.
- Current Assignee: Lenovo Pte. Ltd.
- Current Assignee Address: SG New Tech Park
- Agency: Shimokaji & Assoc., PC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H05K5/00 ; G06F13/00
Abstract:
A supplementary cooling system is provided for cooling a computing system. An apparatus may comprise a computing system and a docking system. The computing system has a cooling area and a fan area which is partionable from the cooling area. The docking system has a fan and an airflow outlet which is operably connected to the fan.
Public/Granted literature
- US20110267769A1 SUPPLEMENTARY COOLING SYSTEM Public/Granted day:2011-11-03
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