Invention Grant
US08503132B2 Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length 有权
头部万向节组件,滑块和制造头部万向节组件的方法,导线长度减小

  • Patent Title: Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length
  • Patent Title (中): 头部万向节组件,滑块和制造头部万向节组件的方法,导线长度减小
  • Application No.: US11509972
    Application Date: 2006-08-25
  • Publication No.: US08503132B2
    Publication Date: 2013-08-06
  • Inventor: Eiki Oosawa
  • Applicant: Eiki Oosawa
  • Applicant Address: NL Amsterdam
  • Assignee: HGST Netherlands B.V.
  • Current Assignee: HGST Netherlands B.V.
  • Current Assignee Address: NL Amsterdam
  • Priority: JP2005-244144 20050825; JP2005-244145 20050825
  • Main IPC: G11B5/60
  • IPC: G11B5/60
Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length
Abstract:
A head gimbal assembly for a hard disk drive includes a head slider having a head element part which performs reading and/or writing of data to/from a magnetic disc and a suspension on which the head slider is mounted. Bonding pads formed on the head slider are formed on a side surface of the head slider except for an air bearing surface (ABS) which faces the magnetic disc and a back surface on a side opposite to the ABS. End peripheries of the bonding pads are arranged to be in contact with an end periphery of the side surface of the head slider which abuts on the back surface of the head slider.
Public/Granted literature
Information query
Patent Agency Ranking
0/0