Invention Grant
- Patent Title: Leaf spring with high vickers hardness
- Patent Title (中): 板簧具有很高的维氏硬度
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Application No.: US13031745Application Date: 2011-02-22
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Publication No.: US08503119B2Publication Date: 2013-08-06
- Inventor: Keiichi Sato , Takashi Uemura , Tomohiko Osaka
- Applicant: Keiichi Sato , Takashi Uemura , Tomohiko Osaka
- Applicant Address: JP Tokyo
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, P.C.
- Priority: JP2010-035824 20100222
- Main IPC: G02B7/02
- IPC: G02B7/02
Abstract:
A leaf spring supports a pillar shaped movable portion disposed in a center portion with respect to a cylindrical fixed portion disposed around the movable portion in the direction of a center axis shiftably so as to position the movable portion in a radial direction. The leaf spring is made of a material having Vickers hardness which is not less than 500 (HV).
Public/Granted literature
- US20110205646A1 LEAF SPRING WITH HIGH VICKERS HARDNESS Public/Granted day:2011-08-25
Information query
IPC分类:
| G | 物理 |
| G02 | 光学 |
| G02B | 光学元件、系统或仪器 |
| G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
| G02B7/02 | .用于透镜 |
