Invention Grant
- Patent Title: Heat transfer assembly, lithographic apparatus and manufacturing method
- Patent Title (中): 传热组件，光刻设备及制造方法
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Application No.: US12834768Application Date: 2010-07-12
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Publication No.: US08502960B2Publication Date: 2013-08-06
- Inventor: Eugene Maria Brinkhof , Joannes Hendricus Maria Van Oers , Robertus Adolphus Maria Kuipers , Vasco Francisco Bovée
- Applicant: Eugene Maria Brinkhof , Joannes Hendricus Maria Van Oers , Robertus Adolphus Maria Kuipers , Vasco Francisco Bovée
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: G03B27/58
- IPC: G03B27/58 ; G03B27/62
Abstract:
A lithographic apparatus includes a heat transfer assembly configured to temperature control at least a portion of the lithographic apparatus. The heat transfer assembly includes a printed circuit board, and a plurality of heat transfer elements. The printed circuit board and the plurality of heat transfer elements are configured to be attached to the portion of the lithographic apparatus. The plurality of heat transfer elements are separate from and are electrically coupled to the printed circuit board.
Public/Granted literature
- US20110007288A1 HEAT TRANSFER ASSEMBLY, LITHOGRAPHIC APPARATUS AND MANUFACTURING METHOD Public/Granted day:2011-01-13
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