Invention Grant
US08502224B2 Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
有权
包括具有硅通孔，加热器和应力传感器的芯片的测量装置
- Patent Title: Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
- Patent Title (中): 包括具有硅通孔，加热器和应力传感器的芯片的测量装置
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Application No.: US12962658Application Date: 2010-12-08
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Publication No.: US08502224B2Publication Date: 2013-08-06
- Inventor: Ra-Min Tain , John H. Lau , Ming-Che Hsieh , Wei Li , Ming-Ji Dai
- Applicant: Ra-Min Tain , John H. Lau , Ming-Che Hsieh , Wei Li , Ming-Ji Dai
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface.
Public/Granted literature
- US20110309357A1 MEASURING APPARATUS Public/Granted day:2011-12-22
Information query
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