Invention Grant
US08502149B2 Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method 有权
热检测器,热检测装置,电子仪器和热检测器制造方法

  • Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
  • Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
  • Application No.: US13329449
    Application Date: 2011-12-19
  • Publication No.: US08502149B2
    Publication Date: 2013-08-06
  • Inventor: Yasushi Tsuchiya
  • Applicant: Yasushi Tsuchiya
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Global IP Counselors, LLP
  • Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
  • Main IPC: G01J5/00
  • IPC: G01J5/00
Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
Abstract:
A thermal detector includes: a substrate; a support member supported so that a cavity is formed between the substrate and the support member; a heat-detecting element supported on the support member; a thermal transfer member disposed over the heat-detecting element, and including a thermal collecting portion made of a material having light-reflecting characteristics and having a pattern with which a portion of light incident to a region defined by the support member as seen in plan view enters towards the support member, and a connecting portion connecting the thermal collecting portion to the heat-detecting element; a first light-absorbing layer contacting the thermal transfer member between the thermal transfer member and the support member; and a second light-absorbing layer contacting the thermal transfer member and disposed on the thermal transfer member.
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