Invention Grant
- Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
- Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
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Application No.: US13329449Application Date: 2011-12-19
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Publication No.: US08502149B2Publication Date: 2013-08-06
- Inventor: Yasushi Tsuchiya
- Applicant: Yasushi Tsuchiya
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
- Main IPC: G01J5/00
- IPC: G01J5/00

Abstract:
A thermal detector includes: a substrate; a support member supported so that a cavity is formed between the substrate and the support member; a heat-detecting element supported on the support member; a thermal transfer member disposed over the heat-detecting element, and including a thermal collecting portion made of a material having light-reflecting characteristics and having a pattern with which a portion of light incident to a region defined by the support member as seen in plan view enters towards the support member, and a connecting portion connecting the thermal collecting portion to the heat-detecting element; a first light-absorbing layer contacting the thermal transfer member between the thermal transfer member and the support member; and a second light-absorbing layer contacting the thermal transfer member and disposed on the thermal transfer member.
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