Invention Grant
- Patent Title: Block copolymer composition and hot-melt adhesive composition
- Patent Title (中): 嵌段共聚物组合物和热熔胶组合物
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Application No.: US13142065Application Date: 2009-12-25
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Publication No.: US08501869B2Publication Date: 2013-08-06
- Inventor: Ryouji Oda , Sadaharu Hashimoto , Ayako Furuko
- Applicant: Ryouji Oda , Sadaharu Hashimoto , Ayako Furuko
- Applicant Address: JP Tokyo
- Assignee: Zeon Corporation
- Current Assignee: Zeon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-335330 20081226; JP2009-047402 20090227
- International Application: PCT/JP2009/071684 WO 20091225
- International Announcement: WO2010/074267 WO 20100701
- Main IPC: C08L53/02
- IPC: C08L53/02 ; C08F297/04 ; C08J5/18

Abstract:
Provided is a hot-melt adhesive composition which can be easily applied at a relatively low temperature, has a long open time, and also has high holding power. A hot-melt adhesive composition comprising a block copolymer composition which includes a block copolymer A and a block copolymer B, and a tackifying resin, wherein a weight ratio (A/B) of the block copolymer A and the block copolymer B is 25/75 to 90/10, and an aromatic vinyl monomer unit content of the block copolymer A is 41% or greater.
Public/Granted literature
- US20110257337A1 BLOCK COPOLYMER COMPOSITION AND HOT-MELT ADHESIVE COMPOSITION Public/Granted day:2011-10-20
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