A sealing compound composition as an adhesive composition contains a vinyl chloride resin, a plasticizer, a filler, a moisture absorbent and an acrylic resin as a pH control material. The moisture absorbent is blended within a range of 0.3 to 2.0% by weight. The acrylic resin is blended within a range of 1.0% by weight or more to less than 7.0% by weight. A blending ratio of the moisture absorbent is half or less than that of the acrylic resin.