Invention Grant
US08501582B2 Semiconductor structure having low thermal stress and method for manufacturing thereof 有权
具有低热应力的半导体结构及其制造方法

Semiconductor structure having low thermal stress and method for manufacturing thereof
Abstract:
A semiconductor structure includes a Si substrate, a supporting layer and a blocking layer formed on the substrate and an epitaxy layer formed on the supporting layer. The supporting layer defines a plurality of grooves therein to receive the blocking layer. The epitaxy layer is grown from the supporting layer. A plurality of slots is defined in the epitaxy layer and over the blocking layer. The epitaxy layer includes an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer. A method for manufacturing the semiconductor structure is also disclosed.
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