Invention Grant
- Patent Title: Semiconductor structure having low thermal stress and method for manufacturing thereof
- Patent Title (中): 具有低热应力的半导体结构及其制造方法
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Application No.: US12975235Application Date: 2010-12-21
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Publication No.: US08501582B2Publication Date: 2013-08-06
- Inventor: Shih-Cheng Huang , Po-Min Tu , Shun-Kuei Yang , Chia-Hung Huang
- Applicant: Shih-Cheng Huang , Po-Min Tu , Shun-Kuei Yang , Chia-Hung Huang
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010217575 20100705
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A semiconductor structure includes a Si substrate, a supporting layer and a blocking layer formed on the substrate and an epitaxy layer formed on the supporting layer. The supporting layer defines a plurality of grooves therein to receive the blocking layer. The epitaxy layer is grown from the supporting layer. A plurality of slots is defined in the epitaxy layer and over the blocking layer. The epitaxy layer includes an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer. A method for manufacturing the semiconductor structure is also disclosed.
Public/Granted literature
- US20120001303A1 SEMICONDUCTOR STRUCTURE HAVING LOW THERMAL STRESS AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2012-01-05
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