Invention Grant
- Patent Title: Method for manufacture of inline integrated circuit system
- Patent Title (中): 在线集成电路系统的制造方法
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Application No.: US13159095Application Date: 2011-06-13
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Publication No.: US08501540B2Publication Date: 2013-08-06
- Inventor: Jae Hak Yee , Junwoo Myung , Byoung Wook Jang , YoungChul Kim
- Applicant: Jae Hak Yee , Junwoo Myung , Byoung Wook Jang , YoungChul Kim
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent I-Chang John Yang
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.
Public/Granted literature
- US20110244635A1 METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM Public/Granted day:2011-10-06
Information query
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