Invention Grant
- Patent Title: Positive resist composition and patterning process
- Patent Title (中): 正抗蚀剂组成和图案化工艺
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Application No.: US12986791Application Date: 2011-01-07
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Publication No.: US08501384B2Publication Date: 2013-08-06
- Inventor: Jun Hatakeyama , Takeru Watanabe , Seiichiro Tachibana
- Applicant: Jun Hatakeyama , Takeru Watanabe , Seiichiro Tachibana
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-002679 20100108
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38
Abstract:
A positive resist composition comprising a polymer having a tetrahydrobenzocycloheptane-substituted secondary or tertiary carboxyl group ester as an acid labile group exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a good pattern profile and minimal edge roughness after exposure, a significant effect of suppressing acid diffusion rate, and improved etching resistance.
Public/Granted literature
- US20110171580A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2011-07-14
Information query
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