Invention Grant
US08501372B2 Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
有权
掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
- Patent Title: Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
- Patent Title (中): 掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
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Application No.: US13248896Application Date: 2011-09-29
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Publication No.: US08501372B2Publication Date: 2013-08-06
- Inventor: Atsushi Kominato , Masahiro Hashimoto , Osamu Nozawa
- Applicant: Atsushi Kominato , Masahiro Hashimoto , Osamu Nozawa
- Applicant Address: JP Tokyo
- Assignee: Hoya Corporation
- Current Assignee: Hoya Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-221661 20100930
- Main IPC: G03F1/26
- IPC: G03F1/26

Abstract:
A mask blank for use in the manufacture of a binary mask adapted to be applied with ArF excimer laser exposure light has, on a transparent substrate, a light-shielding film for forming a transfer pattern. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for exposure light and a thickness of 45 nm or less. The lower layer is made of a material in which the total content of a transition metal and silicon is 90 at % or more, and has a thickness of 30 nm or more. The upper layer has a thickness of 3 nm or more and 6 nm or less. The phase difference between exposure light transmitted through the light-shielding film and exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 30 degrees or less.
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