Invention Grant
- Patent Title: Conductive paste, multilayer ceramic substrate and its production method
- Patent Title (中): 导电胶,多层陶瓷基片及其制作方法
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Application No.: US12161848Application Date: 2007-01-23
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Publication No.: US08501299B2Publication Date: 2013-08-06
- Inventor: Hatsuo Ikeda , Koji Ichikawa
- Applicant: Hatsuo Ikeda , Koji Ichikawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-013994 20060123; JP2006-104383 20060405
- International Application: PCT/JP2007/050993 WO 20070123
- International Announcement: WO2007/083811 WO 20070726
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B32B5/16 ; B32B37/24

Abstract:
A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 μm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ceramic green sheets, and having conductor patterns and via-conductors inside, the via-conductors being formed in via-holes having diameters of 150 μm or less after sintering, containing Ag crystal particles having a particle size of 25 μm or more, and having a porosity of 10% or less.
Public/Granted literature
- US20090011201A1 Conductive Paste, Multilayer Ceramic Substrate and Its Production Method Public/Granted day:2009-01-08
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