Invention Grant
- Patent Title: Polishing composition and polishing method
- Patent Title (中): 抛光组合物和抛光方法
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Application No.: US11969493Application Date: 2008-01-04
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Publication No.: US08501027B2Publication Date: 2013-08-06
- Inventor: Chiyo Horikawa , Koji Ohno , Kazusei Tamai
- Applicant: Chiyo Horikawa , Koji Ohno , Kazusei Tamai
- Applicant Address: JP Nishikasugai-gun, Aichi
- Assignee: Fujimi Incorporated
- Current Assignee: Fujimi Incorporated
- Current Assignee Address: JP Nishikasugai-gun, Aichi
- Agency: Vidas, Arrett & Steinkraus, P.A.
- Main IPC: B44C1/22
- IPC: B44C1/22 ; H01L21/302
Abstract:
A polishing composition includes more than 0.1% by mass of colloidal silica, and water, and has a pH of 6 or less. The polishing composition has the ability to polish a titanium material at a high stock removal rate. Thus, the polishing composition is suitable for use in applications for polishing a titanium-containing object.
Public/Granted literature
- US20080233836A1 POLISHING COMPOSITION AND POLISHING METHOD Public/Granted day:2008-09-25
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