Invention Grant
- Patent Title: Edge ring assembly with dielectric spacer ring
- Patent Title (中): 边缘环组件与介质隔离环
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Application No.: US12415114Application Date: 2009-03-31
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Publication No.: US08500953B2Publication Date: 2013-08-06
- Inventor: Jeremy Chang , Andreas Fischer , Babak Kadkhodayan
- Applicant: Jeremy Chang , Andreas Fischer , Babak Kadkhodayan
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306

Abstract:
An edge ring assembly surrounds a substrate support surface in a plasma etching chamber. The edge ring assembly comprises an edge ring and a dielectric spacer ring. The dielectric spacer ring, which surrounds the substrate support surface and which is surrounded by the edge ring in the radial direction, is configured to insulate the edge ring from the baseplate. Incorporation of the edge ring assembly around the substrate support surface can decrease the buildup of polymer at the underside and along the edge of a substrate and increase plasma etching uniformity of the substrate.
Public/Granted literature
- US20090186487A1 EDGE RING ASSEMBLY WITH DIELECTRIC SPACER RING Public/Granted day:2009-07-23
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