Invention Grant
- Patent Title: Apparatus and method for wet processing substrate
- Patent Title (中): 湿法处理基板的设备和方法
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Application No.: US13161502Application Date: 2011-06-16
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Publication No.: US08500949B2Publication Date: 2013-08-06
- Inventor: Chao-Wen Lin
- Applicant: Chao-Wen Lin
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN201010285001 20100917
- Main IPC: H05K3/00
- IPC: H05K3/00 ; C23F1/00 ; C23F1/08

Abstract:
An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.
Public/Granted literature
- US20120067848A1 APPARATUS AND METHOD FOR WET PROCESSING SUBSTRATE Public/Granted day:2012-03-22
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