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Invention Grant
US08500930B2 Device and method for the application of a sheet-like jointing means onto a contact area of a wafer 有权
将片状接合装置应用于晶片的接触区域的装置和方法

  • Patent Title: Device and method for the application of a sheet-like jointing means onto a contact area of a wafer
  • Patent Title (中): 将片状接合装置应用于晶片的接触区域的装置和方法
  • Application No.: US11078136
    Application Date: 2005-03-11
  • Publication No.: US08500930B2
    Publication Date: 2013-08-06
  • Inventor: Erich Thallner
  • Applicant: Erich Thallner
  • Agency: Kusner & Jaffe
  • Priority: DE102004012618 20040312
  • Main IPC: B32B41/00
  • IPC: B32B41/00
Device and method for the application of a sheet-like jointing means onto a contact area of a wafer
Abstract:
The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.
Abstract(Chinese):

本发明涉及一种用于沿其相应表面接合晶片的装置和相应方法。

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