Invention Grant
US08500460B2 Board to board connectors and assembly thereof with contact-mounting wall having variable thickness 有权
板对板连接器及其组件,其具有可变厚度的接触安装壁

  • Patent Title: Board to board connectors and assembly thereof with contact-mounting wall having variable thickness
  • Patent Title (中): 板对板连接器及其组件,其具有可变厚度的接触安装壁
  • Application No.: US13252079
    Application Date: 2011-10-03
  • Publication No.: US08500460B2
    Publication Date: 2013-08-06
  • Inventor: Yung Mao HuangPo Lin Chang
  • Applicant: Yung Mao HuangPo Lin Chang
  • Applicant Address: TW Shulin, Taipei County
  • Assignee: Assem Technology Co., Ltd.
  • Current Assignee: Assem Technology Co., Ltd.
  • Current Assignee Address: TW Shulin, Taipei County
  • Agent Cheng-Ju Chiang
  • Main IPC: H01R12/00
  • IPC: H01R12/00
Board to board connectors and assembly thereof with contact-mounting wall having variable thickness
Abstract:
A board to board connector includes a connector housing and a number of contacts mounted to the connector housing. The connector housing includes a base and a pair of side walls extending from the base along a vertical direction. Each side wall includes a number of first mounting walls and a plurality of second mounting walls alternatively arranged along a longitudinal direction perpendicular to the vertical direction. The contacts are fixed to the first mounting walls and each contact is positioned by the adjacent two second mounting walls along the longitudinal direction. A thickness of each second mounting wall is variable along the vertical direction for avoiding irrecoverable deformation or damage thereof.
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