Invention Grant
- Patent Title: Compact camera module and method for fabricating the same
- Patent Title (中): 紧凑型相机模块及其制造方法
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Application No.: US13189899Application Date: 2011-07-25
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Publication No.: US08500344B2Publication Date: 2013-08-06
- Inventor: Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
- Applicant: Pai-Chun Peter Zung , Jau-Jan Deng , Wei-Ping Chen
- Applicant Address: TW Hsinchu US CA Santa Clara
- Assignee: VisEra Technologies Co., Ltd.,OmniVision Technologies Inc.
- Current Assignee: VisEra Technologies Co., Ltd.,OmniVision Technologies Inc.
- Current Assignee Address: TW Hsinchu US CA Santa Clara
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: G03B17/00
- IPC: G03B17/00 ; G02B7/02

Abstract:
The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.
Public/Granted literature
- US20130028589A1 COMPACT CAMERA MODULE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2013-01-31
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