Invention Grant
- Patent Title: Method for implanting an electrode that unfurls in response to a predetermined stimulus
- Patent Title (中): 用于植入根据预定刺激而展开的电极的方法
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Application No.: US13716612Application Date: 2012-12-17
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Publication No.: US08483794B2Publication Date: 2013-07-09
- Inventor: Justin C. Williams , Karl A. Sillay , Jiwan Kim , David Niemann , Azam Ahmed
- Applicant: Wisconsin Alumni Research Foundation
- Applicant Address: US WI Madison
- Assignee: Wisconsin Alumni Research Foundation
- Current Assignee: Wisconsin Alumni Research Foundation
- Current Assignee Address: US WI Madison
- Agency: Boyle Fredrickson S.C.
- Main IPC: A61B5/04
- IPC: A61B5/04 ; A61N1/00

Abstract:
A thin-film microelectrode array tailored for long-term, minimally invasive cortical recording or stimulation and method are provided. The microelectrode array includes a flexible element that is movable between a first contracted configuration and a second expanded configuration. An array of contacts is provided on the flexible element. The contacts are engagable with a cortical surface with the flexible element in the expanded configuration. A link operatively connects the array of contacts to a control module. The link is capable of transmitting at least one of cortical recordings and cortical stimulation signals thereon.
Public/Granted literature
- US20130110193A1 Method For Implanting An Electrode That Unfurls In Response To A Predetermined Stimulus Public/Granted day:2013-05-02
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