Invention Grant
US08482456B2 Sensor assembly and method of measuring the proximity of a machine component to an emitter
有权
传感器组件和测量机器部件与发射器的接近度的方法
- Patent Title: Sensor assembly and method of measuring the proximity of a machine component to an emitter
- Patent Title (中): 传感器组件和测量机器部件与发射器的接近度的方法
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Application No.: US12970525Application Date: 2010-12-16
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Publication No.: US08482456B2Publication Date: 2013-07-09
- Inventor: Steven Go , Boris Leonid Sheikman , William Platt
- Applicant: Steven Go , Boris Leonid Sheikman , William Platt
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Jason K. Klindtworth
- Main IPC: G01S13/08
- IPC: G01S13/08
Abstract:
A microwave sensor assembly includes at least one probe including an emitter configured to generate an electromagnetic field from at least one microwave signal. The emitter is also configured to generate at least one loading signal representative of a loading induced within the emitter by an object positioned within the electromagnetic field. The microwave sensor assembly also includes a signal processing device coupled to the at least one probe. The signal processing device includes a linearizer configured to generate a substantially linear output signal based on the at least one loading signal.
Public/Granted literature
- US20120154202A1 Sensor Assembly And Method Of Measuring The Proximity Of A Machine Component To An Emitter Public/Granted day:2012-06-21
Information query
