Invention Grant
- Patent Title: Substrate structure
- Patent Title (中): 基材结构
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Application No.: US12769122Application Date: 2010-04-28
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Publication No.: US08482291B2Publication Date: 2013-07-09
- Inventor: Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
- Applicant: Nobutaka Itoh , Makoto Sakairi , Mami Nakadate
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-119739 20090518
- Main IPC: G01R31/08
- IPC: G01R31/08

Abstract:
A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.
Public/Granted literature
- US20100289500A1 SUBSTRATE STRUCTURE Public/Granted day:2010-11-18
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