Invention Grant
- Patent Title: Integrated circuit arrangement for test inputs
- Patent Title (中): 用于测试输入的集成电路布置
-
Application No.: US12822287Application Date: 2010-06-24
-
Publication No.: US08479070B2Publication Date: 2013-07-02
- Inventor: Ulrich Baur , Lawrence D. Curley , Ronald J. Frishmuth , Ralf Ludewig , Ching L. Tong , Tobias Webel
- Applicant: Ulrich Baur , Lawrence D. Curley , Ronald J. Frishmuth , Ralf Ludewig , Ching L. Tong , Tobias Webel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent William A. Kinnaman, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An integrated circuit chip includes a mainline function logic path communicatively connected to a first input/output (I/O) pin, a test logic path communicatively connected to the first I/O pin, a latch disposed between the communicative connection between the test logic function path and the first I/O pin, a second I/O pin communicatively connected to the latch, the second I/O pin operative to send a signal operative to change a state of the latch.
Public/Granted literature
- US20110320898A1 Integrated Circuit Arrangement For Test Inputs Public/Granted day:2011-12-29
Information query