Invention Grant
- Patent Title: Gallium nitride-based semiconductor laser device, and method for fabricating gallium nitride-based semiconductor laser device
- Patent Title (中): 氮化镓系半导体激光器件及其制造方法
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Application No.: US13431043Application Date: 2012-03-27
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Publication No.: US08477818B2Publication Date: 2013-07-02
- Inventor: Tetsuya Kumano , Masaki Ueno , Takashi Kyono , Yohei Enya , Katsunori Yanashima , Kunihiko Tasai , Hiroshi Nakajima
- Applicant: Tetsuya Kumano , Masaki Ueno , Takashi Kyono , Yohei Enya , Katsunori Yanashima , Kunihiko Tasai , Hiroshi Nakajima
- Applicant Address: JP Osaka-shi, Osaka JP Minato-ku, Tokyo
- Assignee: Sumitomo Electric Industries, Ltd.,Sony Corporation
- Current Assignee: Sumitomo Electric Industries, Ltd.,Sony Corporation
- Current Assignee Address: JP Osaka-shi, Osaka JP Minato-ku, Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2011-144653 20110629
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A gallium nitride-based semiconductor laser device with reduced threshold current. The gallium nitride-based semiconductor laser device is provided with an n-type cladding layer, an n-side light guide layer, an active layer, a p-side light guide layer, and a p-type cladding layer. The n-side light guide layer and the p-side light guide layer both contain indium. Each of indium compositions of the n-side light guide layer and the p-side light guide layer is not less than 2% and not more than 6%. A film thickness of the n-type cladding layer is in the range of not less than 65% and not more than 85% of a total of the film thickness of the n-type cladding layer and a film thickness of the p-type cladding layer.
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