Invention Grant
- Patent Title: Method for manufacturing a semiconductor memory device
- Patent Title (中): 半导体存储器件的制造方法
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Application No.: US13570716Application Date: 2012-08-09
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Publication No.: US08477536B2Publication Date: 2013-07-02
- Inventor: Takeshi Ohgami
- Applicant: Takeshi Ohgami
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2009-019788 20090130
- Main IPC: G11C16/04
- IPC: G11C16/04

Abstract:
A plurality of contact plugs to be connected to a drain region or a source region of each of transistors constituting a sub-word line driver that drives a sub-word line are formed, by using a SAC line technique of selectively etching an insulation layer that covers each of the transistors by using a mask having line-shaped openings provided across a portion in which the contact plugs of each of the transistors are to be formed.
Public/Granted literature
- US20120309156A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2012-12-06
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