Invention Grant
- Patent Title: Package structure and electronic apparatus of the same
- Patent Title (中): 封装结构和电子设备相同
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Application No.: US12874806Application Date: 2010-09-02
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Publication No.: US08477511B2Publication Date: 2013-07-02
- Inventor: Ho-Shyan Lin , Tsu-Yang Wong
- Applicant: Ho-Shyan Lin , Tsu-Yang Wong
- Applicant Address: TW Taipei County
- Assignee: Amazing Microelectronic Corp.
- Current Assignee: Amazing Microelectronic Corp.
- Current Assignee Address: TW Taipei County
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW99204040U 20100308
- Main IPC: H01R9/00
- IPC: H01R9/00
Abstract:
A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.
Public/Granted literature
- US20110214902A1 PACKAGE STRUCTURE AND ELECTRONIC APPARATUS OF THE SAME Public/Granted day:2011-09-08
Information query
