Invention Grant
- Patent Title: Suspension board assembly sheet with circuits and method for manufacturing the same
- Patent Title (中): 具有电路的悬挂板组装片及其制造方法
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Application No.: US12874846Application Date: 2010-09-02
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Publication No.: US08477507B2Publication Date: 2013-07-02
- Inventor: Terukazu Ihara , Tetsuya Ohsawa
- Applicant: Terukazu Ihara , Tetsuya Ohsawa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2009-207662 20090909
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.
Public/Granted literature
- US20110058347A1 Suspension board assembly sheet with circuits and method for manufacturing the same Public/Granted day:2011-03-10
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