Invention Grant
US08477310B2 Measurement method, measurement apparatus, exposure method, and exposure apparatus 有权
测量方法,测量装置,曝光方法和曝光装置

  • Patent Title: Measurement method, measurement apparatus, exposure method, and exposure apparatus
  • Patent Title (中): 测量方法,测量装置,曝光方法和曝光装置
  • Application No.: US11587099
    Application Date: 2005-04-20
  • Publication No.: US08477310B2
    Publication Date: 2013-07-02
  • Inventor: Mitsuru KobayashiMasahiko Yasuda
  • Applicant: Mitsuru KobayashiMasahiko Yasuda
  • Applicant Address: JP Tokyo
  • Assignee: Nikon Corporation
  • Current Assignee: Nikon Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP2004-128536 20040423
  • International Application: PCT/JP2005/007507 WO 20050420
  • International Announcement: WO2005/104196 WO 20051103
  • Main IPC: G01B11/00
  • IPC: G01B11/00
Measurement method, measurement apparatus, exposure method, and exposure apparatus
Abstract:
To perform high-speed and highly accurate measurement by setting desired measuring conditions for each measuring object. In an alignment sensor of exposure apparatus, in the case of performing position measurement for a plurality of sample shots, measurement is performed by changing the measuring conditions, in response to a measuring axis direction, a mark or a layer whereupon a mark to be measured exists. At that time, for the measuring objects to be measured under the same measuring conditions, for example, a position in a Y axis direction and a position in an X axis direction, measurement is continuously performed. When the measuring condition is changed, a baseline value is remeasured. The changeable measuring conditions are wavelength of measuring light, use and selection of a retarder, NA and σ of an optical system, a light quantity of measuring light, illumination shape, signal processing algorithm, etc.
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