Invention Grant
- Patent Title: Method for supporting a tie of a chip to an electronic apparatus
- Patent Title (中): 一种用于将芯片连接到电子设备的方法
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Application No.: US13239740Application Date: 2011-09-22
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Publication No.: US08476921B2Publication Date: 2013-07-02
- Inventor: Peter Laackmann , Marcus Janke
- Applicant: Peter Laackmann , Marcus Janke
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102010047186 20100930
- Main IPC: H03K19/00
- IPC: H03K19/00
Abstract:
A method for supporting a tie of a chip to an electronic apparatus includes generating once a chip-specific characteristic variable in a chip, reading out the chip-specific characteristic variable by the chip, and transmitting characteristic data representing the read-out characteristic variable of the chip to an electronic apparatus.
Public/Granted literature
- US20120182041A1 Method for supporting a tie of a chip to an electronic apparatus Public/Granted day:2012-07-19
Information query
