Invention Grant
- Patent Title: Electrical connection structure
- Patent Title (中): 电气连接结构
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Application No.: US13308249Application Date: 2011-11-30
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Publication No.: US08476759B2Publication Date: 2013-07-02
- Inventor: Yao-Chun Chuang , Chang-Chia Huang , Tsung-Shu Lin , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant: Yao-Chun Chuang , Chang-Chia Huang , Tsung-Shu Lin , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A structure comprises a top metal connector formed underneath a bond pad. The bond pad is enclosed by a first passivation layer and a second passivation layer. A polymer layer is further formed on the second passivation layer. The dimension of an opening in the first passivation layer is less than the dimension of the top metal connector. The dimension of the top metal connector is less than the dimensions of an opening in the second passivation layer and an opening in the polymer layer.
Public/Granted literature
- US20130134563A1 Electrical Connection Structure Public/Granted day:2013-05-30
Information query
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