Invention Grant
- Patent Title: Leadframe, leadframe type package and lead lane
- Patent Title (中): 引线框架，引线框式封装和引线
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Application No.: US13287721Application Date: 2011-11-02
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Publication No.: US08476747B2Publication Date: 2013-07-02
- Inventor: Sheng-Yuan Lee
- Applicant: Sheng-Yuan Lee
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: J.C. Patents
- Priority: TW98122240A 20090701
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads and a first power lead arranged between the pair of first and second differential signal leads. One of the pairs of differential signal leads has half-duplex transmission mode and two of the other pairs of differential signal leads have full-duplex transmission mode.
Public/Granted literature
- US20120043651A1 LEADFRAME, LEADFRAME TYPE PACKAGE AND LEAD LANE Public/Granted day:2012-02-23
Information query
IPC分类:
