A dynamic and end-user configurable controlled impedance interconnect line includes a plurality of conductive pixels, a plurality of thin-film transition material interconnects to electrically connect adjacent conductive pixels in the plurality of conductive pixels, and a plurality of addressable pixel interconnect actuators to selectively heat a respective plurality of the thin-film transition material interconnects. The plurality of addressable pixel interconnect actuators is operable to selectively heat a respective plurality of the thin-film transition material interconnects to form an interconnect line.