Invention Grant
- Patent Title: Semiconductor device and method of manufacture thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12918524Application Date: 2009-02-26
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Publication No.: US08476675B2Publication Date: 2013-07-02
- Inventor: Philippe Meunier-Beillard , Johannes J. T. M. Donkers , Erwin Hijzen
- Applicant: Philippe Meunier-Beillard , Johannes J. T. M. Donkers , Erwin Hijzen
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08102138 20080228; EP08102139 20080228
- International Application: PCT/IB2009/050781 WO 20090226
- International Announcement: WO2009/107086 WO 20090903
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device (10) comprising a bipolar transistor and a field 5 effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22c and 22d) and a base region (33c) of the bipolar transistor. The bipolar transistor is provided with an insulating cavity (92b) provided in the collector region (22c and 22d). The insulating cavity (92b) may be provided by providing a layer (33a) in the collector region (22c), creating an access path, for example by selectively etching polysilicon towards monocrystalline, and removing a portion of the layer (33a) to provide the cavity using the access path. The layer (33a) provided in the collector region may be of SiGe:C. By blocking diffusion from the base region the insulating cavity (92b) provides a reduction in the base collector capacitance and can be described as defining the base contact.
Public/Granted literature
- US20110186841A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-08-04
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